Application Engineer Hybrid Bonding (w/m/d) in Regensburg

ASM AMICRA Microtechnologies GmbH, headquartered in Regensburg, is a worldwide leading supplier for ultra-high precision die attach systems. The ASM AMICRA systems specialize in submicron placement accuracy for the photonics and semiconductor market.

We have been growing continuously for years and are constantly looking for new colleagues. We are currently looking for an:


Application Engineer Hybrid Bonding (w/m/d)

Responsibilities: 

Process Development and Support

  • Collection of process data related to hybrid bonding 
  • Documentation and report generation 
  • Mastering the different scenarios for hybrid bonding (die to wafer, collective die to wafer, wafer to wafer) 
  • Mastering the process from physical/chemical point of view 
  • Acquire knowledge on pre- and post- die bonding processes, especially cleaning, plasma activation and annealing 
  • Provide suggestions based on analysis of results, knowledge collection from papers / journals / books / publications and customer discussions to improve the process or solve problems 
  • Aware and understand different customer needs and priorities


Machine installation and calibration

  • Machine installation and calibration 
  • Machine application setup 
  • Definition of tools and collaterals together with the engineering team 
  • Prepare and perform customer demonstrations and sample setups


Interface between Co-Development partner and Product Line HB

  • Data and information exchange with different stakeholders
  • Aligns closely with PM HB team
  • Roll out of new software, features set and modules Education


Qualifications:

  • At least Bachelor´s degree in Physics, Semiconductor or Electronics 
  • Minimum 3 years of experience in a complex technical environment 
  • Experience within semiconductor front and backend process 
  • Experience in global organization preferable 
  • Material, semiconductor physics 
  • Very good command of English (spoken & written) 
  • Good PC, MS-Office knowledge, Programming language skills desirable 
  • Very strong analytical skills 
  • Excellent communication skills 
  • High level of assertiveness and flexibility 
  • Good behavior in customer relations 
  • Intercultural understanding 
  • Takes initiative in acquiring knowledge pertaining to Hybrid bonding and sharing with colleagues 
  • Willingness to travel (within Europe, to Asia and USA)


We offer you a promising job in a modern high-tech company with a highly motivated team.


Please send your application to:

ASM AMICRA Microtechnologies GmbH

Lisa Knittl

Marie-Curie-Str. 6

93055 Regensburg


hr.amicra@asmpt.com

Jetzt bewerben

Application Engineer Hybrid Bonding (w/m/d)

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ASM AMICRA Microtechnologies GmbH

ASM AMICRA Microtechnologies GmbH

Mehr zum Job

Anzeigenart Stellenangebot
Arbeitszeit Vollzeit
Vertragsart Festanstellung
Berufliche Praxis mit Berufserfahrung
Aus- und Weiterbildung Abschluss Hochschule / Berufsakademie / Duales Studium
Berufskategorie Informationstechnologie, Softwareentwicklung / Software-Entwicklung
Arbeitsort Marie-Curie-Str. 6, 93055 Regensburg

Arbeitgeber

ASM AMICRA Microtechnologies GmbH

Kontakt für Bewerbung

Frau Lisa Knittl
Human Resources

Mehr zum Arbeitgeber

Benefits
ASM AMICRA Microtechnologies GmbH